The need for a new device to solve MOSFET issues has been discussed in this work. We suggest TFETs for low-operational voltage. This study proposes the Dual Metal-Double Gate Tunnel Field Effect Transistor (DMG-DGTFET) for mono and hetero dielectric gate material (HD) to solve these issues with regular Si TFETs. By utilizing low or high work function metals at the gate, the DMG approach lets you control each transfer characteristic individually. This lowers threshold voltage, improves subthreshold slope, and increases ON current. The DMG method and mono/hetero dielectric gate material optimize Si-based TFET performance. Our hetero dielectric gate dielectric is made from SiO2, Al2O3, and HfO2 and other high-K dielectric materials. Si DMG-DGTFET gate dielectric materials were compared. These comprised SiO2, Al2O3, and HfO2 (dielectric constants: 3.9, 9.3, and 22). The dielectric layer’s dielectric constant (K) affected threshold voltage (Vth), Ion/Ioff ratio, capacitance (Ci), mobility, and subthreshold voltage swing (SS). Results showed that SiO2 with a low-K value (K=3.9) had the electrical values below. Ion = -7.42×10-6, Ioff = -1.918×10-10, Ion/Ioff = 3.86×104, Vth = -1.97V, SS = 0.342V per decade, Ci = 16.4pF When SiO2 was replaced with high-K dielectric material HfO2 (K=22), subthreshold voltage altered step-like, increasing Si DMG-DGTFET performance. After adjusting capacitance and Ion/Ioff ratio, Ci = 1.08Nf, Ion = 2.21×10-5, Ioff = 2.5×10-12, Ion/Ioff = 8.77×106, Vth = 1.2V, and SS = 0.15V per decade were achieved. High-K dielectric materials lowered gate leakage current and threshold voltage, improving device transfer properties. All simulations are done in Sivaco TCAD with a 50 nm channel length using the non-local BTBT tunnelling model.