This paper presents a cost-effective and simplified process for fabricating a 5.8 GHz microstrip patch antenna by combining sticker masking with negative photoresist coating on FR4 substrates. Unlike traditional photolithography, which often requires expensive chrome masks and cleanroom facilities, this novel approach employs a standard UV exposure procedure. The process includes double-sided UV exposure, followed by metal etching using 1 M FeCl3 solution to achieve high-fidelity copper patterning. Measurement results show resonance near 5.8 GHz, in close agreement with simulation data from CST. This approach represents a combination of vinyl sticker masking and UV-exposed negative photoresist in the fabrication of highfrequency R F antennas.