Abstract
Printed Circuit Boards (PCBs) are the building blocks for all electronic products. Fabrication of a PCB involves various mechanical and chemical processes. As obtaining accuracy in the mechanical and chemical processes is very difficult, various defects/faults are formed during PCBs fabrication. These fabrication defects lead to performance degradation of electronic products. In this review, we describe various defects present in PCBs under the Through hole and SMD categories. To understand the frequency of occurrence and reason for the occurrence of defects in both manual and machine, PCB fabrication data was collected and analysed from April 2017 to July 2020 as a part of industry collaboration.