This article reports on the development of a simple two-step lithography process for double barrier quantum well (DBQW) InGaAs/AlAs resonant tunneling diode (RTD) on a semi-insulating indium phosphide (InP) substrate using an air-bridge technology. This approach minimizes processing steps, and therefore the processing time as well as the required resources. It is particularly suited for material qualification of new epitaxial layer designs. A DC performance comparison between the proposed process and the conventional process shows approximately the same results. We expect that this novel technique will aid in the recent and continuing rapid advances in RTD technology.