The thermal management of high-performance computing and power electronics systems 10 has become increasingly challenging due to the rise in thermal design power (TDP). Traditional testing systems typically operate under uniform heat load conditions, which may not adequately represent real-world scenarios. To implement a system for testing the thermal performance of liquid cold plates, the research team at SRM University-AP has developed an innovative testing platform that can generate hotspots (non-uniform heat flux), providing an efficient means to test cold plates and heat sinks under realistic operating conditions.
Dr Lakshmi Sirisha Maganti, Associate Professor, Department of Mechanical Engineering, and Mr Mathiyazhagan Shanmugam, PhD Scholar, have made a significant innovation in thermal management and electronic cooling, which has been recognised with the grant of the Indian patent titled “A System for Testing the Thermal Performance of Liquid Cold Plates” (Patent No. 591250; Application No. 202341071069).
Abstract
The present invention generally relates to a system for testing the thermal performance of liquid cold plates. The system offers the capability to generate non-uniform heat loads, simulating real-world scenarios, which traditional testing systems cannot replicate. It features a heater array unit with independent control of multiple electric cartridge heaters, ensuring precise control of heat flux distribution. The system includes proportional integral derivative (PID) temperature controllers, a microprocessor for temperature measurement and control, and a versatile power source for adjusting heat generation. This innovative system streamlines the testing process and enhances accuracy. The system’s unique ability to create non-uniform heat loads enables researchers to assess cold plates’ thermal performance under realistic conditions, aiding in the design and optimization of cooling systems for electronic components. This system provides a valuable platform for the research community, allowing comprehensive assessments of thermal performance in dynamic and non-uniform heat load conditions.
Conventional testing systems typically evaluate cooling solutions under uniform heat loads, which rarely reflect real-world operating conditions. Addressing this challenge, the patented system introduces an advanced testing platform that generates controlled, non-uniform heat loads and hotspots, closely replicating the thermal behaviour of modern electronic components. The innovation integrates independently controlled cartridge heaters, PID-based temperature regulation, microprocessor-driven automation, and real-time thermal monitoring to enable precise assessment of liquid cold plates under realistic conditions.
By enabling comprehensive thermal characterisation and optimisation of cooling technologies, this invention has the potential to advance next-generation electronics, high-performance computing systems, power electronics, and industrial thermal management solutions.